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IS25LE128E-RHLA3:P-TY 数据表(PDF) 2 Page - Integrated Silicon Solution, Inc |
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IS25LE128E-RHLA3:P-TY 数据表(HTML) 2 Page - Integrated Silicon Solution, Inc |
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2 / 197 page ![]() IS25LE256E/128E IS25WE256E/128E Integrated Silicon Solution, Inc.- www.issi.com 2 Rev.A9 03/07/2023 FEATURES • Industry Standard Serial Interface - IS25LE256E: 256Mbit/32Mbyte - IS25LE128E: 128Mbit/16Mbyte - IS25WE256E: 256Mbit/32Mbyte - IS25WE128E: 128Mbit/16Mbyte - 3 or 4 Byte Addressing Mode - Supports Standard SPI, Fast, Dual, Dual I/O, Quad, Quad I/O, SPI DTR, Dual I/O DTR, Quad I/O DTR, and QPI - Software & Hardware Reset - Supports Serial Flash Discoverable Parameters (SFDP) • High Performance Serial Flash (SPI) - 50MHz Normal Read - Up to166Mhz Fast Read (3) - Up to 80MHz DTR (Dual Transfer Rate) - Equivalent Throughput of 664 Mb/s - Selectable Dummy Cycles - Configurable Drive Strength - Supports SPI Modes 0 and 3 - More than 100,000 Erase/Program Cycles - More than 20-year Data Retention - 1-bit ERROR Detection and Correction per 64-bit boundary (with ECC) • Flexible & Efficient Memory Architecture - Chip Erase with Uniform Sector/Block Erase (4/32/64KB or 4/32/256 KB)(2) - Program 1 to 256 or 512 Byte per Page(2) - Program/Erase Suspend & Resume • Efficient Read and Program modes - Low Instruction Overhead Operations - Continuous Read 8/16/32/64 Byte Burst Wrap - Selectable Burst Length - AutoBoot Operation - Data Learning Pattern for training in DTR operation • Low Power with Wide Temp. Ranges - Single Voltage Supply IS25LE: 2.30V to 3.60V IS25WE: 1.70V to 1.95V - 8 mA Active Read Current - 10 µA Standby Current - 1 µA Deep Power Down - Temp Grades: Extended: -40°C to +105°C Auto Grade (A3): -40°C to +125°C • Advanced Security Protection - Software and Hardware Write Protection - Advanced Sector/Block Protection - Top/Bottom Block Protection - Power Supply Lock Protection - 4x256 Byte Dedicated Security Area with OTP User-lockable Bits - 128 bit Unique ID for Each Device (Call Factory) • Industry Standard Pin-out & Packages(1) - M =16-pin SOIC 300mil - L = 8-contact WSON 8x6mm - G = 24-ball TFBGA 6x8mm (4x6 ball array) - H = 24-ball TFBGA 6x8mm (5x5 ball array) - W = KGD (Call Factory) - Green Package (RoHS Compliant, Halogen-Free) and TSCA Compliant Notes: 1. Call Factory for other package options available. 2. For optional 512 Byte Page size with 256 KB Block size, see the Ordering Information. 3. Up to 166MHz for 1.8V, and up to 133MHz for 3.0V. 256/128Mb SERIAL FLASH MEMORY 133MHZ/166MHZ MULTI I/O SPI & QUAD I/O QPI DTR INTERFACE WITH ON CHIP ECC |
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