STM8AF6268ITCU datasheet(88/99 Pages) STMICROELECTRONICS

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Package information

STM8AF6246/48/66/68

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DocID14952 Rev 11

11.4

Thermal characteristics

In case the maximum chip junction temperature (TJmax) specified in Table 21: General

operating conditions on page 52 is exceeded, the functionality of the device cannot be

guaranteed.

TJmax, in degrees Celsius, may be calculated using the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

–TAmax is the maximum ambient temperature in ° C

–

ΘJA is the package junction-to-ambient thermal resistance in ° C/W

–PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

–PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum

chip internal power.

–PI/Omax represents the maximum power dissipation on output pins

Where:

PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH),

taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level

in the application.

11.4.1

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

11.4.2

Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the order code (see

Section 12: Ordering information).

The following example shows how to calculate the temperature range needed for a given

application.

Table 49. Thermal characteristics(1)

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

LQFP 48 - 7 x 7 mm

°C/W

ΘJA

Thermal resistance junction-ambient

LQFP 32 - 7 x 7 mm

°C/W

ΘJA

Thermal resistance junction-ambient

VFQFPN32

°C/W

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