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OPA855 数据表(PDF) 4 Page - Texas Instruments

部件名 OPA855
功能描述  OPA855 8GHz Gain Bandwidth Product, Gain of 7V/V Stable, Bipolar Input Amplifier
PDF  41 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

OPA855 数据表(HTML) 4 Page - Texas Instruments

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1
2
3
4
5
6
7
8
9
10
11
13
12
PAD
#1
FB
NC
IN-
IN+
NC
NC
VS-
VS-
OUT
VS+
VS+
PD
NC
Figure 5-2. Bare Die Package
Table 5-2. Bond Pad Functions
PAD
TYPE
DESCRIPTION
NAME
NO.
FB
1
Input
Feedback connection to output of amplifier
IN–
3
Input
Inverting input
IN+
4
Input
Noninverting input
NC
2,5,6,
13
—
Do not connect
OUT
9
Output
Amplifier output
PD
12
Input
Power down connection. PD = logic low = power off mode; PD = logic high = normal operation.
VS–
7,8
—
Negative voltage supply
VS+
10,11
—
Positive voltage supply
Backside
—
Connect to VS–
Table 5-3. Bare Die Information
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE POTENTIAL
BOND PAD
METALLIZATION
381 μm
Silicon with backgrind
Wafer backside is electrically connected to VS–
AlCu
Table 5-4. Bond Pad Coordinates of Bare Die Version in Microns
PAD NUMBER
PAD NAME
X-MIN
Y-MIN
X-MAX
Y-MAX
1
FB
14.5
537.4
79.5
602.4
2
NC
14.5
379
79.5
444
3
IN–
14.5
227
79.5
292
4
IN+
14.5
68.6
79.5
133.6
5
NC
296.725
34.825
361.725
99.825
6
NC
421.725
34.825
486.725
99.825
7
VS–
545.5
93.8
610.5
158.8
8
VS–
545.5
178.8
610.5
243.8
9
OUT
545.5
303
610.5
368
10
VS+
545.5
427.2
610.5
492.2
11
VS+
545.5
512.2
610.5
577.2
12
PD
421.325
571.175
486.325
636.175
13
NC
297.125
571.175
362.125
636.175
OPA855
SBOS622D – JULY 2018 – REVISED MAY 2025
www.ti.com
4
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Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: OPA855



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