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M41T00CAP 数据表(PDF) 16 Page - STMicroelectronics |
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M41T00CAP 数据表(HTML) 16 Page - STMicroelectronics |
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16 / 24 page ![]() Maximum ratings M41T00CAP 4 Maximum ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4: Absolute maximum ratings Sym Parameter Value Unit TSTG Storage temperature (VCC off, oscillator off) –55 to 125 °C VCC Supply voltage –0.3 to 7 V TSLD (1)(2) Lead solder temperature for 10 seconds 260 °C VIO Input or output voltages –0.3 to VCC +0.3 V IO Output current 20 mA PD Power dissipation 1 W Notes: (1) For DIP packaged devices, ultrasonic vibrations should not be used for post-solder cleaning to avoid damaging the crystal. (2) Soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds. In order to protect the lithium battery, preheat temperatures must be limited such that the battery temperature does not exceed +85 °C. Furthermore, the devices shall not be exposed to IR reflow. Negative undershoots below –0.3 volts are not allowed on any pin while in the battery backup mode. 16/24 DocID014557 Rev 6 |
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