1.2

Characteristics (curves)

Figure 1. Average forward power dissipation versus

average forward current (per diode)

0

1

2

3

4

5

6

7

0

1

2

3

4

5

6

7

8

9

10

PF(AV)(W)

T

δ=tp/T

tp

IF(AV)(A)

δ = 0.05

δ = 0.1

δ = 0.2

δ = 0.5

δ = 1

Figure 2. Average forward current versus ambient

temperature (δ = 0.5, per diode)

0

1

2

3

4

5

6

7

8

9

0

25

50

75

100

125

150

175

Rth(j-a)=Rth(j-c)

TO-220AB / I²PAK / D²PAK

TO-220FPAB

IF(AV)(A)

Tamb(°C)

Figure 3. Normalized avalanche power derating versus

pulse duration (Tj = 125 °C)

P

(tp)

P

(10 µs)

ARM

ARM

0.001

0.01

0.1

1

1

10

100

1000

t (µs)

p

Figure 4. Relative variation of thermal impedance junction

to case versus pulse duration (TO-220AB, D2PAK,I2PAK)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

Z

/ R

th(j-c)

th(j-c)

t (s)

p

Single pulse

Figure 5. Relative thermal impedance junction to case

versus pulse duration (TO-220FPAB)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Single pulse

t (s)

p

th(j-c)

R

th(j-c)

Z

/

Figure 6. Reverse leakage current versus reverse voltage

applied (typical values, per diode)

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

0

10

20

30

40

50

60

70

80

Tj = 25 °C

Tj = 50 °C

Tj = 75 °C

Tj = 125 °C

Tj = 150 °C

Tj = 100 °C

V (V)

R

I (µA)

R

STPS15LCD80C

Characteristics (curves)

DS7077 - Rev 3

page 4/18