4

REF2912, REF2920, REF2925

REF2930, REF2933, REF2940

SBVS033C – JUNE 2002 – REVISED JUNE 2016

www.ti.com

Product Folder Links: REF2912 REF2920 REF2925 REF2930 REF2933 REF2940

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Copyright © 2002–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Short-circuit to ground.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, V+ to V–

7

V

Output short circuit(2)

Continuous

°C

Lead temperature (soldering, 10 s)

300

°C

Operating temperature

–40

125

°C

Junction temperature

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1500

(1)

Minimum supply voltage for the REF2912 is 1.8 V.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

Input voltage

VREF + 0.05

(1)

5.5

V

ILOAD

Load current

25

mA

TA

Operating temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

REF29xx

UNIT

DBZ (SOT-23)

3 PINS

RθJA

Junction-to-ambient thermal resistance

297.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

128.5

°C/W

RθJB

Junction-to-board thermal resistance

91.7

°C/W

ψJT

Junction-to-top characterization parameter

12.8

°C/W

ψJB

Junction-to-board characterization parameter

90.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W