4

REF3112, REF3120, REF3125

REF3130, REF3133, REF3140

SBVS046D – DECEMBER 2003 – REVISED MARCH 2016

www.ti.com

Product Folder Links: REF3112 REF3120 REF3125 REF3130 REF3133 REF3140

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Copyright © 2003–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, V+ to V–

7

V

Output short circuit

Continuous

Operating temperature

–55

135

°C

Junction temperature

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

Minimum supply voltage for the REF3112 is 1.8 V.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

Input voltage

VREF + 0.05

(1)

5.5

V

ILOAD

Load current

25

mA

TA

Operating temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

THERMAL METRIC(1)

REF31xx

UNIT

DBZ (SOT-23)

3 PINS

RθJA

Junction-to-ambient thermal resistance

292.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

124.4

°C/W

RθJB

Junction-to-board thermal resistance

89

°C/W

ψJT

Junction-to-top characterization parameter

11.4

°C/W

ψJB

Junction-to-board characterization parameter

87.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

Minimum supply voltage for the REF3112 is 1.8 V.

7.5 Electrical Characteristics

at TA = 25°C, ILOAD = 0 mA, and VIN = 5 V (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

REF3312(1) — 1.25 V

VOUT

Output voltage

1.2475

1.25

1.2525

V

Initial accuracy

–0.2%

0.2%

Output voltage noise

f = 0.1 Hz to 10 Hz

17

μVPP

f = 10 Hz to 10 kHz

24

μVRMS