‡

J

A

D

-$

T

T

P

R

9

3

L

SS

I

(23.75 * 10

) * R

(0.15 * 10

)

9

3

L

SS

I

(27.08 * 10

) * R

(0.25 * 10

)

9

3

L

SS

I

(31.25 * 10

) * R

(0.25 * 10

)

9

3

SC

SS

I

(115 * 10

) * R

(4.6 * 10

)

9

3

SC

SS

I

(80 * 10

) * R

(3 * 10

)

REF(MAX)

REF(MIN)

6

REF

V

V

Drift

10

(ppm)

V

Temperature Range

§

·

x

¨

¸

x

©

¹

22

REF6125, REF6130, REF6133, REF6141, REF6145, REF6150

SBOS747B – MAY 2016 – REVISED AUGUST 2016

www.ti.com

Product Folder Links: REF6125 REF6130 REF6133 REF6141 REF6145 REF6150

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Copyright © 2016, Texas Instruments Incorporated

Feature Description (continued)

9.3.2 Temperature Drift

The REF61xx family is designed for minimal drift error, defined as the change in output voltage over temperature.

The drift is calculated using the box method, as described by the following equation:

(3)

9.3.3 Load Current

The REF6125, REF6130, REF6133 and REF6141 are specified to deliver current load of ±4 mA. The REF6145

is specified to deliver ±3.5 mA, and the REF6150 is specified to deliver ±3 mA. The REF61xx are protected from

short circuits at the output by limiting the output short-circuit current.

The short-circuit current limit (ISC) of the REF61xx family of devices is adjusted by connecting a resistor (RSS) on

the SS pin. The short-circuit current limit when the REF61xx device is sourcing current can be calculated as

shown in Equation 4:

(4)

The short circuit current limit when the REF61xx device is sinking is calculated as shown in Equation 5:

(5)

The recommended output current of the REF61xx also depends on the resistor connected to the SS pin. The

recommended output current (sourcing and sinking) for the REF6125, REF6130, REF6133 and REF6141 is

given by Equation 6:

(6)

The recommended output current (sourcing and sinking) for the REF6145 is given by Equation 7:

(7)

The recommended output current (sourcing and sinking) for the REF6150 is given by Equation 8:

(8)

The temperature of the device increases according to Equation 9:

where:

•

TJ = junction temperature (°C).

•

TA = ambient temperature (°C).

•

PD = power dissipated (W).

•

RθJA = junction-to-ambient thermal resistance (°C/W).

(9)

The REF61xx maximum junction temperature must not exceed the absolute maximum rating of 150°C.