Figure 7. Relative variation of thermal impedance junction

to ambient versus pulse duration (SMC)

tp(s)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z

/ R

th(j-a)

th(j-a)

Single pulse

Figure 8. Relative variation of thermal impedance junction

to case versus pulse duration (DPAK)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Zth(j-c)/Rth(j-c)

Single pulse

1.E-03

1.E-02

1.E-01

1.E+00

tp(s)

Figure 9. Reverse leakage current versus reverse voltage

applied (typical values)

IR(mA)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

0

5

10

15

20

25

30

35

40

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=25°C

VR(V)

Figure 10. Junction capacitance versus reverse voltage

applied (typical values)

C(pF)

10

100

1000

1

1 0

100

F=1MHz

V

= 30mV

T= 25°C

OSC

R MS

j

VR(V)

Figure 11. Forward voltage drop versus forward current

IF(A)

0.01

0.10

1.00

10.00

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Tj=25°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

Tj=125°C

(Maximum values)

VF(V)

Figure 12. Thermal resistance junction to ambient versus

copper surface under each lead (SMA Flat Notch)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

SMA Flat Notch

STPS340

Characteristics (curves)

DS0792 - Rev 13

page 5/19