Figure 13. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

Figure 14. Thermal resistance junction to ambient versus

copper surface under each lead (SMB flat)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SCu(cm²)

Rth(j-a) (°C/W)

SMB flat

Epoxy printed circuit board FR4, e

Cu = 35 µm

Figure 15. Thermal resistance junction to ambient versus

copper surface under each lead (SMC)

0

20

40

60

80

100

120

140

160

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Rth(j-a) (°C/W)

SCu(cm²)

SMC

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

Figure 16. Thermal resistance junction to ambient versus

copper surface under tab (DPAK)

0

10

20

30

40

50

60

70

80

90

100

0

5

10

15

20

25

30

35

40

SCu(cm²)

Rth(j-a) (°C/W)

DPAK

Epoxy printed circuit board, copper thickness: 35 µm

STPS340

Characteristics (curves)

DS0792 - Rev 13

page 6/19