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FERD30H100STS 数据表(PDF) 4 Page - STMicroelectronics |
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FERD30H100STS 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 13 page  Characteristics FERD30H100S 4/13 DocID029159 Rev 2 Figure 7: Thermal resistance junction to ambient versus copper surface under tab for DPAK (typical values) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 SCu(cm²) Rth(j-a) (°C/W) DPAK Epoxy printed board FR4, eCu= 35 µm 90 100 |
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