Figure 5. Junction capacitance versus reverse voltage

applied (typical values)

100

1000

10000

1

10

100

C(pF)

VR(V)

F = 1 MHz

VOSC = 30 mVRMS

Tj = 25 °C

Figure 6. Forward voltage drop versus forward current

(typical values)

0.1

1.0

10.0

100.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

IF(A)

VF(V)

Tj = 75 °C

Tj = 25 °C

Tj = 125 °C

Figure 7. Forward voltage drop versus forward current

(typical values)

0

10

20

30

40

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

IF(A)

VF(V)

Tj = 125 °C

Tj = 25 °C

Tj = 75 °C

Figure 8. Thermal resistance junction to ambient versus

copper surface under tab (typical values)

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

Rth(j-a) (°C/W)

D²PAK

Epoxy printed board FR4, copper thickness = 35 µm

SCu(cm²)

FERD40H100S

Characteristics (curves)

DS11576 - Rev 2

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