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SN74LVC1G38

SCES538G – JANUARY 2004 – REVISED FEBRUARY 2020

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Copyright © 2004–2020, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 6

6.6

Switching Characteristics, CL = 15 pF ...................... 6

6.7

Switching Characteristics, CL = 30 pF or 50 pF,

–40°C to +85°C.......................................................... 6

6.8

Switching Characteristics, CL = 30 pF or 50 pF,

–40°C to +125°C........................................................ 7

6.9

Operating Characteristics.......................................... 7

6.10

Typical Characteristics ............................................ 7

7

Parameter Measurement Information .................. 8

8

Detailed Description ............................................ 10

8.1

Overview ................................................................. 10

8.2

Functional Block Diagram ....................................... 10

8.3

Feature Description................................................. 10

8.4

Device Functional Modes........................................ 11

9

Application and Implementation ........................ 12

9.1

Application Information............................................ 12

9.2

Typical Application ................................................. 12

10

Power Supply Recommendations ..................... 13

11

Layout................................................................... 13

11.1

Layout Guidelines ................................................. 13

11.2

Layout Example .................................................... 13

12

Device and Documentation Support ................. 14

12.1

Documentation Support ........................................ 14

12.2

Receiving Notification of Documentation Updates 14

12.3

Support Resources ............................................... 14

12.4

Trademarks ........................................................... 14

12.5

Electrostatic Discharge Caution ............................ 14

12.6

Glossary ................................................................ 14

13

Mechanical, Packaging, and Orderable

Information ........................................................... 14

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (October) to Revision G

Page

•

Changed the TA high-end temp from +1255°C to +125°C in the Test Conditions field of the Electrical Characteristics

table. ...................................................................................................................................................................................... 6

Changes from Revision E (August 2017) to Revision F

Page

•

Added values for DPW (X2SON) package in Thermal Information table. ............................................................................. 5

Changes from Revision D (December 2013) to Revision E

Page

•

Added DPW (X2SON) package.............................................................................................................................................. 1

•

Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal

Information table, Typical Characteristics, Detailed Description section, Application and Implementation section,

Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section .................................................................................................................................................................................... 1

•

Added Maximum junction temperature, TJ ............................................................................................................................. 4

•

Changed values in the Thermal Information table to align with JEDEC standards................................................................ 5

Changes from Revision C (March 2011) to Revision D

Page

•

Updated document to new TI data sheet format. ................................................................................................................... 1

•

Updated Ioff in Features. ......................................................................................................................................................... 1

•

Added ESD warning. .............................................................................................................................................................. 1

•

Updated operating temperature range. .................................................................................................................................. 5