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UCD3138RJAT 数据表(PDF) 95 Page - Texas Instruments |
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UCD3138RJAT 数据表(HTML) 95 Page - Texas Instruments |
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95 / 99 page  www.ti.com PACKAGE OUTLINE C 9.15 8.85 9.15 8.85 1.0 0.8 0.05 0.00 2X 7.5 60X 0.5 2X 7.5 64X 0.5 0.3 64X 0.30 0.18 4.25 0.1 (0.2) TYP VQFN - 1 mm max height RGC0064B PLASTIC QUAD FLATPACK - NO LEAD 4219010/A 10/2018 0.08 C 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM EXPOSED THERMAL PAD SYMM 1 16 17 32 33 48 49 64 65 SCALE 1.500 A B |
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