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UCD3138RMHT 数据表(PDF) 96 Page - Texas Instruments |
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UCD3138RMHT 数据表(HTML) 96 Page - Texas Instruments |
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96 / 99 page  www.ti.com EXAMPLE BOARD LAYOUT 60X (0.5) (R0.05) TYP 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND (0.695) TYP (1.18) TYP (0.695) TYP (1.18) TYP 64X (0.6) 64X (0.24) (8.8) (8.8) ( 4.25) ( 0.2) TYP VIA VQFN - 1 mm max height RGC0064B PLASTIC QUAD FLATPACK - NO LEAD 4219010/A 10/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SEE SOLDER MASK DETAIL 1 16 17 32 33 48 49 64 65 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS |
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