HCS512

DS40151D-page 20

© 2002 Microchip Technology Inc.

10.2

Package Details

18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

15

10

5

15

10

5

β

Mold Draft Angle Bottom

15

10

5

15

10

5

α

Mold Draft Angle Top

10.92

9.40

7.87

.430

.370

.310

eB

Overall Row Spacing

§

0.56

0.46

0.36

.022

.018

.014

B

Lower Lead Width

1.78

1.46

1.14

.070

.058

.045

B1

Upper Lead Width

0.38

0.29

0.20

.015

.012

.008

c

Lead Thickness

3.43

3.30

3.18

.135

.130

.125

L

Tip to Seating Plane

22.99

22.80

22.61

.905

.898

.890

D

Overall Length

6.60

6.35

6.10

.260

.250

.240

E1

Molded Package Width

8.26

7.94

7.62

.325

.313

.300

E

Shoulder to Shoulder Width

0.38

.015

A1

Base to Seating Plane

3.68

3.30

2.92

.145

.130

.115

A2

Molded Package Thickness

4.32

3.94

3.56

.170

.155

.140

A

Top to Seating Plane

2.54

.100

p

Pitch

18

18

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

1

2

D

n

E1

c

eB

β

E

α

p

A2

L

B1

B

A

A1

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-007

§ Significant Characteristic