1.1

Characteristics (curves)

Figure 3. Average forward current versus lead

temperature (δ = 0.5)

0

1

2

3

4

5

6

7

8

9

0

25

50

75

100

125

150

175

Tl (°C)

IF(AV)(A)

T

δ=tp/T

tp

Figure 4. Relative variation of thermal impedance junction

to lead versus pulse duration

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

tP(s)

Zth(j-l ) /Rth(j-l )

Single pulse

Figure 5. Reverse leakage current versus reverse voltage

applied (typical values)

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

0

10

20

30

40

50

60

70

80

90

100

VR(V)

IR(µA)

Tj = 150 °C

Tj = 25 °C

Tj = 100 °C

Tj = 75 °C

Tj = 50 °C

Tj = 125 °C

Figure 6. Junction capacitance versus reverse voltage

applied (typical values)

10

100

1000

1

10

100

C(pF)

F = 1 MHz

OSC = 30 mVRMS

Tj = 25 °C

V

VR(V)

Figure 7. Forward voltage drop versus forward current

(typical values)

0.1

1.0

10.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

VF(V)

IF(A)

Tj = 125 °C

Tj = 75 °C

Tj = 150 °C

Tj = 25 °C

Tj = -40 °C

Figure 8. Thermal resistance junction to ambient versus

copper surface under each lead (typical values, epoxy

printed board FR4, eCu= 70 µm)

0

30

60

90

120

150

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Rth(j-a)(°C/W)

SOD128flat

SCu(cm²)

Epoxy printed board FR4, copper thickness: 70 μm

STPST3H100-Y

Characteristics (curves)

DS13611 - Rev 2

page 4/9