Extruded

Heat Sinks

All other products, please contact factory for price, delivery, and minimums.

Normally stocked

51

413/421/423 SERIES

Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes

Space-saving double surface 413, 421, and 423 Series utilize finned surface

area on both sides of the power semiconductor mounting surface to provide

maximum heat dissipation in a compact profile. Ready to install on popular

power components in natural and forced convection applications. Apply

Wakefield Type 126 silicone-free thermal compound or Wakefield DeltaPad™

interface materials for maximum performance. Material: Aluminum Alloy, Black

Anodized.

TO-3; DO-5; Stud-Mount

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

401 AND 403 SERIES Double-Surface Heat Sinks for TO-3 Case Styles

TO-3; Stud-Mount

With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks

are recommended for critical space applications where maximum heat dissipation is required

for high-power TO-3 case styles. Forced convection performance is also exemplary with these

double surface fin types. Semiconductor mounting hole style “F” offers a single centered

0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize)

for mounting stud-type diodes and rectifiers. Hole pattem “V" available upon request.

Material: Aluminum Alloy, Black Anodized.

Standard

Width

Overall Dimensions

Height

Semiconductor

Thermal Performance at Typical Load

Weight

P/N

in. (mm)

in. (mm)

in. (mm)

Mounting Hole Pattem

Natural Convection

Forced Convection

lbs. (grams)

401A

4.750 (120.7)

1.500 (38.1)

1.250 (31.8)

(1) TO-3

80°C @ 30W

1.5° C/W @ 250 LFM

0.1500 (68.04)

401F

4.750 (120.7)

1.500 (38.1)

1.250 (31.8)

0.270 in. (6.9)-Dia Hole

80°C @ 30W

1.5° C/W @ 250 LFM

0.1500 (68.04)

401K

4.750 (120.7)

1.500 (38.1)

1.250 (31.8)

None

80°C @ 30W

1.5° C/W @ 250 LFM

0.1500 (68.04)

403A

4.750 (120.7)

3.000 (76.2)

1.250 (31.8)

(1) TO-3

55°C @ 30W

0.9° C/W @ 250 LFM

0.3500 (158.76)

403F

4.750 (120.7)

3.000 (76.2)

1.250 (31.8)

0.270 in. (6.9)-Dia Hole

55°C @ 30W

0.9° C/W @ 250 LFM

0.3500 (158.76

403K

4.750 (120.7)

3.000 (76.2)

1.250 (31.8)

None

55°C @ 30W

0.9° C/W @ 250 LFM

0.3500 (158.76)

MECHANICAL DIMENSIONS

SEMICONDUCTOR MOUNTING HOLES

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

403 SERIES

A

F

K

V

401 SERIES

401 AND 403 SERIES

(EXTRUSION

PROFILE 1024)

413 SERIES

(EXTRUSION

PROFILE 2276

421 SERIES

(EXTRUSION

PROFILE 1025)

SERIES

413

421

423 SERIES

(EXTRUSION PROFILE 1025)

A

F

K

V

Nominal Dimensions

Standard

Width

Length

Height “A”

Semiconductor

Thermal Performance at Typical Load

Weight

P/N

in. (mm)

in. (mm)

in. (mm)

Mounting Hole Pattern Natural Convection

Forced Convection

lbs. (grams)

413A

4.750 (120.7)

3.000 (76.2)

1.875 (47.6)

(1) TO-3

72° C @ 50W

0.85° C/W @ 250 LFM

0.6300 (285.77)

413F

4.750 (120.7)

3.000 (76.2)

1.875 (47.6)

0.270 in. (6.9)-Dia Hole

72° C @ 50W

0.85° C/W @ 250 LFM

0.6300 (285.77)

413K

4.750 (120.7)

3.000 (76.2)

1.875 (47.6)

None

72° C @ 50W

0.85° C/W @ 250 LFM

0.6300 (285.77)

421A

4.750 (120.7)

3.000 (76.2)

2.625 (66.7)

(1) TO-3

58° C @ 50W

0.7° C/W @ 250 LFM

0.6300 (285.77)

421F

4.750 (120.7)

3.000 (76.2)

2.625 (66.7)

0.270 in. (6.9)-Dia Hole

58° C @ 50W

0.7° C/W @ 250 LFM

0.6300 (285.77)

421K

4.750 (120.7)

3.000 (76.2)

2.625 (66.7)

None

58° C @ 50W

0.7° C/W @ 250 LFM

0.6300 (285.77)

423A

4.750 (120.7)

5.500 (140.2)

2.625 (66.7)

(1) TO-3

47° C @ 50W

0.5° C/W @ 250 LFM

1.1700 (530.71)

423K

4.750 (120.7)

5.500 (140.2)

2.625 (66.7)

None

47° C @ 50W

0.5° C/W @ 250 LFM

1.1700 (530.71)

Dimensions: in. (mm)

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

SEMICONDUCTOR MOUNTING HOLES

NATURAL AND FORCED

CONVECTION CHARACTERISTICS