TL072IP datasheet(11/89 Pages) TI2

11 / 89 page

5.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, (VCC+) – (VCC–)

All NS and PS packages; All TL07xM devices(1)

All other devices

4.5

Input voltage

All NS and PS packages; All TL07xM devices

(VCC–) + 2

(VCC+) + 0.1

All other devices

(VCC–) + 4

(VCC+) + 0.1

Specified temperature(2)

TL07xM

–55

125

°C

TL07xH

–40

125

TL07xI

–40

TL07xC

(1)

VCC+ and VCC– are not required to be of equal magnitude, provided that the total VS ((VCC+) – (VCC–)) is between 10 V and 30 V.

(2)

See also Section 9.1.1.

5.4 Thermal Information for Single Channel

THERMAL METRIC(1)

TL071xx

UNIT

(SOIC)

DCK

(SC70)

DBV

(SOT-23)

(PDIP)

(SO)

8 PINS

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

158.8

217.5

212.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

98.6

113.1

111.1

–

°C/W

RθJB

Junction-to-board thermal resistance

102.3

63.8

79.4

–

°C/W

ψJT

Junction-to-top characterization parameter

45.8

34.8

51.8

–

°C/W

ψJB

Junction-to-board characterization parameter

101.5

63.5

79.0

–

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

5.5 Thermal Information for Dual Channel

THERMAL METRIC(1)

TL072xx

UNIT

(SOIC)

DDF

(SOT-23)

(LCCC)

(CDIP)

(PDIP)

(SO)

(TSSOP)

(CFP)

8 PINS

20 PINS

8 PINS

10 PINS

RθJA

Junction-to-ambient

thermal resistance

147.8

181.5

–

200.3

169.8

°C/W

RθJC(top)

Junction-to-case (top)

thermal resistance

88.2

112.5

5.61

15.05

–

89.4

62.1

°C/W

RθJB

Junction-to-board

thermal resistance

91.4

98.2

–

131.0

176.2

°C/W

ψJT

Junction-to-top

characterization

parameter

36.8

17.2

–

22.2

48.4

°C/W

ψJB

Junction-to-board

characterization

parameter

90.6

97.6

–

129.3

144.1

°C/W

RθJC(bot)

Junction-to-case

(bottom) thermal

resistance

N/A

–

N/A

5.4

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

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TL071, TL071A, TL071B, TL071H

TL072, TL072A, TL072B, TL072H, TL072M

TL074, TL074A, TL074B, TL074H, TL074M

SLOS080W – SEPTEMBER 1978 – REVISED JULY 2025

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