5.3 ESD Ratings - TL331B and TL391B

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±750

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.4 ESD Ratings, TL331 and TL331K

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±750

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.5 Recommended Operating Conditions, TL331B and TL391B

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage

2

36

V

TJ

Junction temperature

–40

125

°C

5.6 Recommended Operating Conditions, TL331 and TL331K

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage

2

36

V

TJ

Junction temperature, TL331

–40

85

°C

TJ

Junction temperature, TL331K

–40

105

°C

5.7 Thermal Information

THERMAL METRIC(1)

TL331x, TL391x

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

211.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

133.6

°C/W

RθJB

Junction-to-board thermal resistance

79.9

°C/W

ψJT

Junction-to-top characterization parameter

56.4

°C/W

ψJB

Junction-to-board characterization parameter

79.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.

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TL331, TL331B, TL391B

SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024

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