TL431ACLPR datasheet(33/85 Pages) TI2

33 / 85 page

10.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

Changes from Revision R (August 2023) to Revision S (May 2024)

Page

• Updated pinout diagrams................................................................................................................................... 4

Changes from Revision Q (July 2022) to Revision R (August 2023)

Page

• Updated Applications section links..................................................................................................................... 1

• Updated Description section...............................................................................................................................1

• Removed KTP package......................................................................................................................................4

• Added detailed Temperature Coefficient and Dynamic Impedance sections................................................... 19

• Updated Applications section........................................................................................................................... 26

• Updated LP package in Device Nomenclature figure.......................................................................................32

Changes from Revision P (November 2018) to Revision Q (July 2022)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Corrected the device names in the Pin Functions table..................................................................................... 4

Changes from Revision O (January 2015) to Revision P (November 2018)

Page

• Added text to the Description section.................................................................................................................1

• Added TL43x Device Comparison Table ........................................................................................................... 3

• Added TL43x Device Nomenclature section.................................................................................................... 32

Changes from Revision N (January 2014) to Revision O (January 2015)

Page

• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information

table, Feature Description section, Device Functional Modes, Application and Implementation section, Power

Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.............................................................................. 1

• Added Applications.............................................................................................................................................1

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser based versions of this data sheet, refer to the left hand navigation.

www.ti.com

TL431, TL432

SLVS543S – AUGUST 2004 – REVISED MAY 2024

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