TLC27M4CPWR datasheet(4/51 Pages) TI2

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BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4 ´ 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE ± 10%.

ALL DIMENSIONS ARE IN MILS.

PIN (11) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

–

1OUT

1IN +

1IN–

VDD

(4)

(6)

(3)

(2)

(5)

(1)

–

(7)

2IN +

2IN–

2OUT

(11)

GND

–

3OUT

3IN +

3IN–

(13)

(10)

(9)

(12)

(8)

–

(14)

4OUT

4IN +

4IN–

108

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

(10)

(11)

(12)

(13)

(14)

TLC27M4, TLC27M4A, TLC27M4B, TLC27M4Y, TLC27M9

SLOS093D – OCTOBER 1987 – REVISED OCTOBER 2012

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TLC27M4Y chip information

This chip, when properly assembled, displays characteristics similar to the TLC27M4C. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

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Product Folder Links: TLC27M4 TLC27M4A TLC27M4B TLC27M4Y TLC27M9

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