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TLV2170IDRG4 数据表(PDF) 29 Page - Texas Instruments

部件名 TLV2170IDRG4
功能描述  TLVx170 36-V, Single-Supply, EMI-Hardened, Low-Power Operational Amplifiers for Cost-Sensitive Systems
PDF  47 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

TLV2170IDRG4 数据表(HTML) 29 Page - Texas Instruments

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PACKAGE MATERIALS INFORMATION
www.ti.com
1-Nov-2025
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0
P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TLV170IDBVR
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV170IDBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV170IDBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV170IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV2170IDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV2170IDGKRG4
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV2170IDGKT
VSSOP
DGK
8
250
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV2170IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV2170IDRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV4170IDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TLV4170IPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TLV4170IPWRG4
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1



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