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TLV3601DBVT 数据表(PDF) 6 Page - Texas Instruments |
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TLV3601DBVT 数据表(HTML) 6 Page - Texas Instruments |
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6 / 45 page ![]() 6.4 Thermal Information THERMAL METRIC TLV3601 TLV3601 TLV3602 TLV3602 TLV3603 (E) UNIT DBV (SOT-23) DCK (SC70) DGK (VSSOP) DSG (WSON) DCK (SC70) 5 PINS 5 PINS 8 PINS 8 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 176.5 187.5 170.5 64.9 165.1 °C/W Rθ JC(top ) Junction-to-case (top) thermal resistance 74.7 139.2 61.7 83.9 129.1 °C/W Rθ JC(bot tom) Junction-to-case (bottom) thermal resistance N/A N/A N/A 5.5 N/A °C/W RθJB Junction-to-board thermal resistance 43.4 65.8 92.4 32.0 58.9 °C/W ψJT Junction-to-top characterization parameter 16.7 43.0 8.9 2.1 39.4 °C/W ψJB Junction-to-board characterization parameter 43.1 65.5 90.8 32.0 58.7 °C/W TLV3601, TLV3602, TLV3603, TLV3603E SNOSDB1E – JUNE 2021 – REVISED APRIL 2023 www.ti.com 6 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TLV3601 TLV3602 TLV3603 TLV3603E |
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