TLV9001UIDBVR datasheet(5/109 Pages) TI2

5 / 109 page

• Changed TLV9002 D (SOIC) junction-to-ambient thermal resistance value from 147.4°C/W to 207.9°C/W... 15

• Changed TLV9002 D (SOIC) junction-to-case (top) thermal resistance from 94.3°C/W to 92.8°C/W..............15

• Changed TLV9002 D (SOIC) junction-to-board thermal resistance from 89.5°C/W to 129.7°C/W...................15

• Changed TLV9002 D (SOIC) junction-to-top characterization parameter from 47.3°C/W to 26°C/W.............. 15

• Changed TLV9002 D (SOIC) junction-to-board characterization parameter from 89°C/W to 127.9°C/W........ 15

• Added DGK (VSSOP) thermal information to Thermal Information: TLV9002 table ........................................15

• Added TLV9002 PW (TSSOP) thermal information to Thermal Information: TLV9002 table........................... 15

• Added PW (TSSOP) thermal information to Thermal Information: TLV9002 table ..........................................16

Changes from Revision A (December 2017) to Revision B (March 2018)

Page

• Added package preview notes to TLV9001 packages, TLV9004 packages, and TLV9002 8-pin VSSOP

package in Device Information table ................................................................................................................. 1

• Added package preview notes to TLV9001, TLV9004 and TLV9002 VSSOP package pinout drawings in Pin

Configuration and Functions section ................................................................................................................. 7

• Deleted package preview note from TLV9002 DSG (WSON) pinout drawing in Pin Configurations and

Functions section................................................................................................................................................7

• Deleted package preview note from TLV9002 RUG (X2QFN) pinout drawing in Pin Configurations and

Functions section................................................................................................................................................7

• Added DSG (WSON) package thermal information to the Thermal Information: TLV9002 table..................... 15

• Deleted package preview note from DSG (WSON) package in Thermal Information: TLV9002 table............. 15

• Added D (SOIC) package thermal information to the Thermal Information: TLV9004 table.............................16

Changes from Revision * (October 2017) to Revision A (December 2017)

Page

• Changed device status from Advance Information to Production Data/Mixed Status........................................ 1

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TLV9001, TLV9002, TLV9004

SBOS833R – OCTOBER 2017 – REVISED NOVEMBER 2021

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Product Folder Links: TLV9001 TLV9002 TLV9004

TLV9001UIDBVR 数据表(PDF) 5 Page - Texas Instruments

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