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TLV9001UIDBVR.A 数据表(PDF) 4 Page - Texas Instruments |
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TLV9001UIDBVR.A 数据表(HTML) 4 Page - Texas Instruments |
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4 / 109 page  Changes from Revision G (September 2018) to Revision H (October 2018) Page • Changed From: TLV9001 DCK Package To: TLV9001T DCK Package............................................................. 7 Changes from Revision F (August 2018) to Revision G (September 2018) Page • Added Device Comparison Table ...................................................................................................................... 6 • Changed pin names for all devices and all packages.........................................................................................7 • Changed pin names and I/O designation on some TLV9001 pins .....................................................................7 • Changed the pin number for V+ in the SOIC, TSSOP column of the Pin Functions: TLV9004 table................. 7 Changes from Revision E (July 2018) to Revision F (August 2018) Page • Added Scalabe CMOS Amplifier for Low-Cost Applications feature.................................................................. 1 • Deleted PREVIEW designation on TLV9002 and TLV9004 devices with the TSSOP package. ....................... 1 • Added TLV9001U DBV (SOT-23) pinout drawing to Pin Configuration and Functions section ......................... 7 • Added SOT-23 U Pinout to Pin Functions section ............................................................................................. 7 Changes from Revision D (June 2018) to Revision E (July 2018) Page • Corrected typo in Description section ................................................................................................................1 • Added TLV9001 5-pin X2SON package to Device Information table ................................................................ 1 • Added TLV9001S 6-pin SOT-23 package to Device Information table...............................................................1 • Added TLV9004 14-pin and 16-pin WQFN packages to Device Information table ............................................1 • Added TLV9001 DPW (X2SON) pinout drawing to Pin Configuration and Functions section............................ 7 • Added TLV9001S 6-pin SOT-23 package to Pin Configuration and Functions section...................................... 7 • Added TLV9004 RTE pinout information to Pin Configuration and Functions section .......................................7 • Added DPW (X2SON) and DRL (SOT-553) packages to Thermal Information: TLV9001 table.......................15 • Added Thermal Information: TLV9001S table to Specifications section........................................................... 15 • Added RUG (X2QFN) package to Thermal Information: TLV9002 table.......................................................... 15 • Added RTE (WQFN) and RUC (WQFN) packages to Thermal Information: TLV9004 table............................16 Changes from Revision C (May 2018) to Revision D (June 2018) Page • Added shutdown text to Description section.......................................................................................................1 • Added TLV9002S and TLV9004S devices to Device Information table..............................................................1 • Added TLV9002S 10-pin X2QFN package to Device Information table............................................................. 1 • Added TLV9002S DGS package pinout information to Pin Configurations and Functions section.................... 7 • Added Thermal Information: TLV9001 table to Specifications section............................................................. 15 • Added Thermal Information: TLV9004 table to Specifications section............................................................. 16 • Added shutdown section to Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 1.8 V to 5.5 V table.................................................................................................................................................................. 17 • Added Shutdown section.................................................................................................................................. 27 Changes from Revision B (March 2018) to Revision C (May 2018) Page • Added TLV9002 16-pin TSSOP package to Device Information table............................................................... 1 • Added TLV9002 10-pin X2QFN package to Device Information table............................................................... 1 • Added TLV9002S DGS package pinout drawing in Pin Configurations and Functions section..........................7 • Added TLV9004 pinout diagram and pin configuration table to Pin Configuration and Functions section ........ 7 • Added TLV9004S pinout diagram and pin configuration table to Pin Configuration and Functions section ...... 7 TLV9001, TLV9002, TLV9004 SBOS833R – OCTOBER 2017 – REVISED NOVEMBER 2021 www.ti.com 4 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TLV9001 TLV9002 TLV9004 |
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