TLV9041UIDBVR.A datasheet(8/78 Pages) TI2

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7.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

TLV9042

TLV9042S

UNIT

(SOIC)

DDF

(SOT-23-8)

DSG

(WSON)

(TSSOP)

DGK

(VSSOP)

RUG

(X2QFN)

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal

resistance

148.3

203.8

99.8

203.1

196.6

196.9

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

89.8

123.9

122.2

91.9

87.5

87.6

°C/W

RθJB

Junction-to-board thermal

resistance

91.6

121.6

66.0

133.8

118.5

117.8

°C/W

ψJT

Junction-to-top

characterization parameter

38.6

21.7

13.8

23.7

25.7

3.4

°C/W

ψJB

Junction-to-board

characterization parameter

90.9

199.6

65.9

132.1

116.8

117.6

°C/W

RθJC(bot)

Junction-to-case (bottom)

thermal resistance

n/a

41.9

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TLV9044, TLV9044S

UNIT

(SOIC)

(TSSOP)

DYY

(SOT-23-14)

14 PINS

RθJA

Junction-to-ambient thermal resistance

116.4

135.7

152.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

72.5

78.8

86.2

°C/W

RθJB

Junction-to-board thermal resistance

72.4

63.9

67.4

°C/W

ψJT

Junction-to-top characterization parameter

30.8

14.2

10.1

°C/W

ψJB

Junction-to-board characterization parameter

78.3

67.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TLV9041, TLV9042, TLV9044

SBOS836G – MARCH 2020 – REVISED MARCH 2022

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