132

RoHS Compliant, ELV Compliant

HF Halogen Free

12

Solder Reflow and Rework Recommendation for Surface-mount Devices

Classification Reflow Profiles

Solder Reflow

• Recommended reflow methods:

- IR

- Hot air

- Nitrogen

• Recommended maximum paste thickness: 0.25mm (0.010 inch)

• Devices can be cleaned using standard methods and aqueous solvents.

• We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed

underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.

• Customer should validate that the solder paste amount and reflow recommendations meet its application.

• We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch

devices. It is possible that raised features could negatively impact solderability performance of our devices.

Rework

• femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices.

Please also avoid direct contact to the device.

• SMD series: rework should be confined to removal of the installed product and replacement with a fresh device.

Profile Feature

Pb-Free Assembly

Average ramp up rate (TsMAX to Tp)

3°C/second max.

Preheat

• Temperature min. (TsMIN)

150°C

• Temperature max. (TsMAX)

200°C

• Time (tsMIN to tsMAX)

60-120 seconds

Time maintained above:

• Temperature (TL)

217°C

• Time (tL)

60-150 seconds

Peak/Classification temperature (Tp)

260°C

Time within 5°C of actual peak temperature

Time (tp)

30 seconds max.

Ramp down rate

3°C/second max.

Time 25°C to peak temperature

8 minutes max.

Critical Zone

T

L to Tp

Ramp up

t 25˚C to Peak

Reflow Profile

Time

Ramp down

ts

Preheat

Ts

MAX

T

L

Tp

tp

25

Ts

MIN

t

L

Figure S14

Note: All temperatures refer to topside of the package, measured on the package

body surface.

W

8.0 ± 0.30

8.0 ± 0.30

8.0 ± 0.30

8.0 ± 0.30

12.0 ± 0.30

24.0 ± 0.30

16.0 ± 0.30

16.0 ± 0.30

16.0 ± 0.30

P0

4.0 ± 0.10

4.0 ± 0.10

4.0 ± 0.10

4.0 ± 0.10

4.0 ± 0.10

4.0 ± 0.10

4.0 ± 0.10

4.0 ± 0.10

4.0 ± 0.10

P1

4.0 ± 0.10

4.0 ± 0.10

4.0 ± 0.10

4.0 ± 0.10

8.0 ± 0.10

8.0 ± 0.10

8.0 ± 0.10

8.0 ± 0.10

12.0 ± 0.10

P2

2.0 ± 0.05

2.0 ± 0.05

2.0 ± 0.05

2.0 ± 0.05

2.0 ± 0.05

2.0 ± 0.10

2.0 ± 0.10

2.0 ± 0.10

2.0 ± 0.10

A0

Table S8

Table S8

1.95 ± 0.10

2.9 ± 0.10

Table S8

5.70 ± 0.10

5.11 ± 0.15

5.6 ± 0.23

6.9 ± 0.23

B0

Table S8

Table S8

Table S8

3.50 ± 0.10

Table S8

11.90 ± 0.10

5.6 ± 0.23

8.1 ± 0.15

9.6 ± 0.15

B1 max.

4.35

4.35

4.35

4.35

8.2

20.1

12.1

12.1

12.1

D0

1.55 ± .05

1.55 ± .05

1.55 ± .05

1.55 ± .05

1.5 + 0.10/ -.00

1.55 ± .05

1.5 + 0.10/ -.00

1.5 + 0.10/ -.00

1.5 + 0.10/ -.00

F

3.50 ± 0.05

3.50 ± 0.05

3.50 ± 0.05

3.50 ± 0.05

5.50 ± 0.05

11.50 ± 0.10

7.50 ± 0.10

7.50 ± 0.10

7.50 ± 0.10

E1

1.75 ± 0.10

1.75 ± 0.10

1.75 ± 0.10

1.75 ± 0.10

1.75 ± 0.10

1.75 ± 0.10

1.75 ± 0.10

1.75 ± 0.10

1.75 ± 0.10

E2 min.

6.25

6.25

6.25

6.25

10.25

22.25

14.25

14.25

14.25

T max.

0.6

0.6

0.6

0.6

0.6

0.6

0.6

0.6

0.6

T1 max.

0.1

0.1

0.1

0.1

0.1

0.1

0.1

0.1

0.1

K0

Table S8

Table S8

Table S8

Table S8

Table S8

0.95 ± 0.10

1.8 ± 0.15

3.2 ± 0.15

3.4 ± 0.15

Leader min.

390

390

390

390

390

400

400

400

400

Trailer min.

160

160

160

160

160

160

160

160

160

Description

nanoSMDC

EIA 481-1

microSMD

EIA 481-1

miniSMDC

and

decaSMDC050F/60

EIA 481-1

miniSMDE190

EIA 481-2

midSMD

except

decaSMDC050F/60

EIA 481-2

SMD

EIA 481-2

SMD2

EIA 481-2

picoSMDC

EIA 481-1

femtoSMDC

EIA 481-1

Table S7 Tape and Reel Specifications for Surface-mount Devices (in Millimeters)