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TS556 数据表(PDF) 16 Page - STMicroelectronics |
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TS556 数据表(HTML) 16 Page - STMicroelectronics |
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16 / 19 page ![]() Package information TS556 16/19 DocID4078 Rev 4 5.1 SO14 package information Figure 8. SO14 package outline Note: D and F dimensions do not include mold flash or protrusions. Mold flash or protrusions must not exceed 0.15 mm. Table 11. SO14 mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 1.35 1.75 0.05 0.068 A1 0.10 0.25 0.004 0.009 A2 1.10 1.65 0.04 0.06 B 0.33 0.51 0.01 0.02 C 0.19 0.25 0.007 0.009 D 8.55 8.75 0.33 0.34 E 3.80 4.0 0.15 0.15 e 1.27 0.05 H 5.80 6.20 0.22 0.24 h 0.25 0.50 0.009 0.02 L 0.40 1.27 0.015 0.05 k 8° (max.) ddd 0.10 0.004 |
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