TSA1203

Package mechanical data

27/30

11

Package mechanical data

In order to meet environmental requirements, STMicroelectronics offers these devices in

ECOPACK® packages. These packages have a Lead-free second level interconnect. The

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

trademark. ECOPACK specifications are available at: www.st.com.

11.1

TQFP48 package

DIM.

mm.

inch

MIN.

TYP

MAX.

MIN.

TYP.

MAX.

A

1.6

0.063

A1

0.05

0.15

0.002

0.006

A2

1.35

1.40

1.45

0.053

0.055

0.057

B

0.17

0.22

0.27

0.007

0.009

0.011

C

0.09

0.20

0.0035

0.0079

D

9.00

0.354

D1

7.00

0.276

D3

5.50

0.216

e

0.50

0.020

E

9.00

0.354

E1

7.00

0.276

E3

5.50

0.216

L

0.45

0.60

0.75

0.018

0.024

0.030

L1

1.00

0.039

K

0˚3.5˚7˚

0˚3.5˚7˚

TQFP48 MECHANICAL DATA

0110596/C

Obsolete

Product(s)

- Obsolete

Product(s)