6.7 Typical Characteristics (LM50B and LM50C)

To generate these curves the device is mounted to a printed circuit board as shown in Figure 8-14 or Figure 8-15.

Figure 6-1. Thermal Resistance Junction-to-Ambient (Legacy

chip)

Figure 6-2. Thermal Time Constant (Legacy chip)

Figure 6-3. Thermal Response in Still Air With Heat Sink

(Legacy chip)

.

Figure 6-4. Thermal Response in Stirred Oil Bath With Heat Sink

(Legacy chip)

TIME (Seconds)

0

10

20

30

40

50

60

0

25

50

75

100

125

Legacy chip

New chip

Figure 6-5. Thermal Response in Stirred Oil Bath With Heat Sink

(0.5 inches × 0.5 inches PCB board)

TIME (Seconds)

0

10

20

30

40

50

60

0

25

50

75

100

125

Legacy chip

New chip

Figure 6-6. Thermal Response in Stirred Oil Bath Without Heat

Sink

LM50, LM50HV

SNIS118I – JULY 1999 – REVISED OCTOBER 2025

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