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TMP468AIYFFR 数据表(PDF) 29 Page - Texas Instruments |
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TMP468AIYFFR 数据表(HTML) 29 Page - Texas Instruments |
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29 / 49 page  29 TMP468 www.ti.com SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017 Product Folder Links: TMP468 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TMP468 device requires a transistor connected between the D+ and D– pins for remote temperature measurement. Tie the D+ pin to D– if the remote channel is not used and only the local temperature is measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup resistors as part of the communication bus. TI recommends a 0.1-µF power-supply decoupling capacitor for local bypassing. Figure 22 and Figure 23 illustrate the typical configurations for the TMP468 device. |
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