TPS2500, TPS2501

SLVS886C – OCTOBER 2008 – REVISED AUGUST 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

Eco-mode™

DEVICE

TEMPERATURE(2)

PACKAGE

MARKING

Control Scheme

TPS2500

Enabled

CHO

–40°C to 85°C

DRC (SON)

TPS2501

Disabled

OBA

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

Maximum ambient temperature is a function of device junction temperature and system-level considerations, such as power dissipation

and board layout. See Dissipation Ratings and Recommended Operating Conditions for specific information related to these devices.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

Input voltage range on SW(2), AUX, IN, USB, ENUSB, EN, FAULT, ILIM

–0.3 to 7

V

FAULT sink current

25

mA

ILIM source current

1

mA

TJ

Junction temperature range

–40 to 150

°C

ESD – HBM

2

kV

ESD – CDM

500

V

ESD – system level (contact/air)(3)

8/15

kV

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Leading edge voltage spikes on SW during normal switching operation may exceed 7 V and are within the intended operation of the

device as long as the maximum voltage does not exceed 10 V for 25 ns. It is important to follow the recommended layout guidelines to

minimize voltage overshoot. Do not force an external voltage source directly on SW.

(3)

Surges per EN61000-4-2, 1999 applied between USB and output ground of the TPS2500EVM (HPA337) evaluation module

(documentation available on the Web). These were the test levels, not the failure threshold.

DISSIPATION RATINGS

(1)

THERMAL RESISTANCE(2)

THERMAL RESISTANCE

TA ≤ 25°C

PACKAGE

qJA

qJC

POWER RATING

DRC

41.6°C/W

10.7°C/W

2403 mW

(1)

The JEDEC high-K (2s2p) board used to derive this data was a 3-inch × 3-inch (7.62-mm × 7.62-mm), multilayer board with 1-ounce

(0.035-mm) internal power and ground planes and 2-ounce (0.071-mm) copper traces on the top and bottom of the board.

(2)

Mounting per the PowerPAD™ Thermally Enhanced Package application report (SLMA002).

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

VIN

Supply voltage at IN

1.8

5.25

V

VSTART

Supply voltage at IN for start-up

2.2

V

Enable voltage at EN, ENUSB

0

5.25

V

TJ

Operating junction temperature range

–40

125

°C

2

Submit Documentation Feedback

Copyright © 2008–2010, Texas Instruments Incorporated

Product Folder Link(s): TPS2500 TPS2501