TPS16632RGER datasheet(30/46 Pages) TI2

30 / 46 page

• The trace routing for the R(ILIM), R(PLIM) component to the device must be as short as possible to reduce

parasitic effects on the current limit and power limit accuracy. These traces must not have any coupling to

switching signals on the board.

• Protection devices such as TVS, snubbers, capacitors, or diodes must be placed physically close to the

device they are intended to protect, and routed with short traces to reduce inductance. For example, TI

recommends a protection Schottky diode to address negative transients due to switching of inductive loads,

and it must be physically close to the OUT and GND pins.

• Thermal Considerations: when properly mounted, the PowerPAD package provides significantly greater

cooling ability. To operate at rated power, the PowerPAD must be soldered directly to the board GND plane

directly under the device. Other planes, such as the bottom side of the circuit board, can be used to increase

heat sinking in higher current applications.

TPS1663

SLVSET9F – SEPTEMBER 2018 – REVISED FEBRUARY 2023

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TPS16632RGER 数据表(PDF) 30 Page - Texas Instruments