Figure 11. Thermal resistance, junction to ambient, versus

copper surface under tab (epoxy printed board FR4, eCu =

35µm) (D²PAK)

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

SCu(cm²)

Figure 12. Average forward current versus ambient

temperature (δ = 0.5, per diode)

0

1

2

3

4

5

6

7

8

9

10

11

12

0

25

50

75

100

125

150

175

I

(A)

F(AV)

T

(°C)

amb

R

= R

th(j-a)

th(j-c)

TO-220AB / I²PAK / D²PAK

TO-220FPAB

STTH2003

Characteristics (curves)

DS1213 - Rev 12

page 5/16