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STTH25M06FP 数据表(PDF) 7 Page - STMicroelectronics |
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STTH25M06FP 数据表(HTML) 7 Page - STMicroelectronics |
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7 / 13 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DPAK package information • Epoxy meets UL 94,V0 • Cooling method: by conduction (C) Figure 15. DPAK package outline L1 L A1 R R D c A c2 V2 A2 H L4 e1 e b L2 E b4 Gauge plane 0.25 D1 E1 Thermal pad Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. STTH25M06 Package information DS13169 - Rev 2 page 7/13 |
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