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STTH8L06DIRG 数据表(PDF) 5 Page - STMicroelectronics |
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STTH8L06DIRG 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 11 page ![]() STTH8L06 Characteristics Doc ID 8373 Rev 6 5/11 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (D2PAK) 0 10 20 30 40 50 60 70 0 5 10 15 20 25 30 35 40 S(Cu)(cm²) R (°C/W) th(j-a) epoxy FR4, Cu = 35 µm |
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