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STPSC8H065DI 数据表(PDF) 10 Page - STMicroelectronics |
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STPSC8H065DI 数据表(HTML) 10 Page - STMicroelectronics |
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10 / 16 page ![]() 2.3 TO-220AC package information • Epoxy meets UL 94,V0 • Cooling method: by conduction (C) • Recommended torque value: 0.55 N·m • Maximum torque value: 0.70 N·m Figure 15. TO-220AC package outline A C D L7 Ø I L5 L6 L9 L4 F H2 G L2 F1 E M Gate note (1)(2) (1) :Max resin gate protusion 0.5 mm (2) :Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical Gate note (1)(2) 0.10 STPSC8H065 TO-220AC package information DS9225 - Rev 8 page 10/16 |
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