M24C32-RBN5TGP datasheet(21/39 Pages) STMICROELECTRONICS

21 / 39 page

M24128, M24C64, M24C32

Initial delivery state

21/39

Initial delivery state

The device is delivered with all bits in the memory array set to 1 (each byte contains FFh).

Maximum rating

Stressing the device outside the ratings listed in Table 7 may cause permanent damage to

the device. These are stress ratings only, and operation of the device at these, or any other

conditions outside those indicated in the Operating sections of this specification, is not

implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability. Refer also to the STMicroelectronics SURE Program and other relevant

quality documents.

Table 7.

Absolute maximum ratings

Symbol

Parameter

Min.

Max.

Unit

Ambient operating temperature

–40

130

°C

TSTG

Storage temperature

–65

150

°C

TLEAD

Lead temperature during soldering

see note (1)

Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®

7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)

2002/95/EU.

°C

PDIP-specific lead temperature during soldering

260(2)

TLEAD max must not be applied for more than 10 s.

°C

VIO

Input or output range

–0.50

6.5

IOL

DC output current (SDA = 0)

VCC

Supply voltage

–0.50

6.5

VESD

Electrostatic discharge voltage (human body model)(3)

AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500

Ω, R2=500 Ω)

–4000

4000

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