TOP232P datasheet(35/36 Pages) POWERINT

35 / 36 page

Rev. C 06/15

TOP232-234

www.power.com

Notes:

1. Package dimensions conform to JEDEC specification

MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)

package with .300 inch row spacing.

2. Controlling dimensions are inches. Millimeter sizes are

shown in parentheses.

3. Dimensions shown do not include mold flash or other

protrusions. Mold flash or protrusions shall not exceed

.006 (.15) on any side.

4. Pin locations start with Pin 1, and continue counter-clock-

wise to Pin 8 when viewed from the top. The notch and/or

dimple are aids in locating Pin 1. Pin 6 is omitted.

5. Minimum metal to metal spacing at the package body for

the omitted lead location is .137 inch (3.48 mm).

6. Lead width measured at package body.

7. Lead spacing measured with the leads constrained to be

perpendicular to plane T.

.008 (.20)

.015 (.38)

.300 (7.62) BSC

(NOTE 7)

.300 (7.62)

.390 (9.91)

.367 (9.32)

.387 (9.83)

.240 (6.10)

.260 (6.60)

.125 (3.18)

.145 (3.68)

.057 (1.45)

.068 (1.73)

.120 (3.05)

.140 (3.56)

.015 (.38)

MINIMUM

.048 (1.22)

.053 (1.35)

.100 (2.54) BSC

.014 (.36)

.022 (.56)

-E-

Pin 1

SEATING

PLANE

-D-

-T-

P08B

PDIP-8B (P Package)

PI-2551-040110

D S .004 (.10)

⊕

T E D S .010 (.25) M

⊕

(NOTE 6)

.137 (3.48)

MINIMUM

SMD-8B (G Package)

PI-2546-040110

.004 (.10)

.012 (.30)

.036 (0.91)

.044 (1.12)

.004 (.10)

0 -

° 8°

.367 (9.32)

.387 (9.83)

.048 (1.22)

.009 (.23)

.053 (1.35)

.032 (.81)

.037 (.94)

.125 (3.18)

.145 (3.68)

-D-

Notes:

1. Controlling dimensions are

inches. Millimeter sizes are

shown in parentheses.

2. Dimensions shown do not

include mold flash or other

protrusions. Mold flash or

protrusions shall not exceed

.006 (.15) on any side.

3. Pin locations start with Pin 1,

and continue counter-clock-

wise to Pin 8 when viewed

from the top. Pin 6 is omitted.

4. Minimum metal to metal

spacing at the package body

for the omitted lead location

is .137 inch (3.48 mm).

5. Lead width measured at

package body.

6. D and E are referenced

datums on the package

body.

.057 (1.45)

.068 (1.73)

(NOTE 5)

E S

.100 (2.54) (BSC)

.372 (9.45)

.240 (6.10)

.388 (9.86)

.137 (3.48)

MINIMUM

.260 (6.60)

.010 (.25)

-E-

Pin 1

D S .004 (.10)

⊕

G08B

.420

.046 .060 .060 .046

.080

Pin 1

.086

.186

.286

Solder Pad Dimensions

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