TPS73233DBVR datasheet(24/47 Pages) TI2

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7.4.1.1.1 Power Dissipation

The ability to remove heat from the die is different for each package type, presenting different considerations

in the PCB layout. The PCB area around the device that is free of other components moves the heat from

the device to the ambient air. Performance data for JEDEC low- and high-K boards are shown in the Thermal

Information table. Using heavier copper increases the effectiveness in removing heat from the device. The

addition of plated through-holes to heat-dissipating layers also improves the heat-sink effectiveness.

Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product

of the output current times the voltage drop across the output pass transistor (VIN to VOUT):

OUT

) I

(6)

Power dissipation is minimized by using the lowest possible input voltage necessary to provide the required

output voltage.

7.4.2 Layout Examples

NR/FB

GND PLANE

CIN

COUT

N/C

VOUT

VIN

TPS736xxDRB

Figure 7-11. Fixed Output Voltage Option Layout (DRB Package)

TPS732

SBVS037R – AUGUST 2003 – REVISED MAY 2025

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TPS73233DBVR 数据表(PDF) 24 Page - Texas Instruments