6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage range at terminals(2)

SW, VOUT

–0.3

6.0

V

Operating Junction Temperature,TJ

–40

150

°C

Storage Temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage range

0.9

5.5

V

VOUT

Output voltage range

1.8

5.5

V

L

Inductor (effective)

0.7

2.2

13

µH

COUT

Output capacitor (effective)

4.7

16

100

µF

TJ

Operating junction temperature

-40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TPS61322

UNIT

DBZ (SOT-23)

DBV (SOT-23)

3-PIN

5-PIN

RθJA

Junction-to-ambient thermal resistance

322.2

189.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

107.0

109.4

°C/W

RθJB

Junction-to-board thermal resistance

65.8

56.5

°C/W

ψJT

Junction-to-top characterization parameter

7.5

33.3

°C/W

ψJB

Junction-to-board characterization parameter

64.5

56.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TPS61322

SLVSDY5E – JANUARY 2018 – REVISED FEBRUARY 2024

www.ti.com

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