TSC2004 datasheet(2/62 Pages) TI2

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ABSOLUTE MAXIMUM RATINGS

(1)

TSC2004

SBAS408E – JUNE 2007 – REVISED MARCH 2008

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

TYPICAL

NO MISSING

INTEGRAL

GAIN

CODES

SPECIFIED

TRANSPORT

LINEARITY

ERROR

RESOLUTION

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

MEDIA,

PRODUCT

(LSB)

(BITS)

TYPE

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

Small Tape

TSC2004IRTJT

20-Pin,

and Reel, 250

0.8 x 4 x 4

RTJ

–40

°C to +85°C

TSC2004I

Tape and

Thin QFN

TSC2004IRTJR

Reel, 3000

TSC2004

–0.8 to +1.4

+0.1

18-Pin,

Small Ta\pe

TSC2004IYZKT

5 x 5 Matrix,

and Reel, 250

2.5 x 2.5

YZK

–40

°C to +85°C

TSC2004I

Tape and

DSBGA

TSC2004IYZKR

Reel, 3000

(WCSP)

(1)

For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see

the TI website at www.ti.com.

Over operating free-air temperature range (unless otherwise noted).

TSC2004

UNIT

Analog input X+, Y+, AUX to SNSGND

–0.4 to SNSVDD + 0.1

Analog input X–, Y– to SNSGND

–0.4 to SNSVDD + 0.1

SNSVDD to SNSGND

–0.3 to 5

Voltage range

SNSVDD to AGND

–0.3 to 5

I/OVDD to DGND

–0.3 to 5

SNSVDD to I/OVDD

–2.40 to +0.3

Digital input voltage to DGND

–0.3 to I/OVDD + 0.3

Digital output voltage to DGND

–0.3 to I/OVDD + 0.3

Power dissipation

(TJ Max - TA)/θJA

Low-K

113

°C/W

WCSP package

Thermal impedance,

High-K

°C/W

QFN package

39.97

°C/W

Operating free-air temperature range, TA

–40 to +85

°C

Storage temperature range, TSTG

–65 to +150

°C

Junction temperature, TJ Max

+150

°C

Vapor phase (60 sec)

+215

°C

Lead temperature

Infrared (15 sec)

+220

°C

IEC contact discharge(2)

X+, X–, Y+, Y–

±12

IEC air discharge(2)

X+, X–, Y+, Y–

±25

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to

absolute-maximum rated conditions for extended periods may affect device reliability.

(2)

Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.

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