6.4 Thermal Information

THERMAL METRIC(1)

TUSB522P

UNIT

RGE (VQFN)

24 PINS

RθJA

Junction-to-ambient thermal resistance

51.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

55.9

°C/W

RθJB

Junction-to-board thermal resistance

28.3

°C/W

ψJT

Junction-to-top characterization parameter

2.0

°C/W

ψJB

Junction-to-board characterization parameter

28.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

9.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics, Power Supply

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ICC(ACTIVE)

Average active current

Link in U0 with GEN1 data transmission.

RSV, EQ cntrl pins = NC, EN_RXD = VCC,

k28.5 pattern at 5Gbps,

VID = 1000 mVpp, OS = 900 mV and DE =

3.5 dB

98

mA

ICC(U2U3)

Average current in U2/U3

Link in U2 or U3

1.2

mA

ICC(NC)

Average current disconnect mode

Link in Disconnect mode

265

µA

ICC(SHUTDOWN)

Average shutdown current

EN_RXD = L

60

µA

6.6 Electrical Characteristics, DC

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

3-State CMOS Inputs(EQ1/2, DE1/2)

VIH

High-level input voltage

VCC x 0.8

V

VIM

Mid-level input voltage

VCC / 2.

V

VIL

Low-level input voltage

VCC x 0.2

V

VF

Floating voltage

VIN = High impedance

0.36 x VCC

V

RPU

Internal pull-up resistance

410

kΩ

RPD

Internal pull-down resistance

240

kΩ

IIH

High-level input current

VIN = 3.6 V

26

µA

IIL

Low-level input current

VIN = GND, VCC = 3.6.V

–26

µA

2-State CMOS Input (OS1/2, EN_RXD)

VIH

High-level input voltage

VCC x 0.7

V

VIL

Low-level input voltage

VCC x 0.3

V

RPD

Internal pull-down resistance

660

kΩ

IIH

Low-level input current

VIN = 3.6 V

25

µA

IIL

Low-level input current

VIN = GND, VCC = 3.6.V

–10

µA

TUSB522P

SLLSEV9E – JULY 2016 – REVISED NOVEMBER 2023

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