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LRF2512-R02JW 数据表(PDF) 2 Page - TT Electronics. |
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LRF2512-R02JW 数据表(HTML) 2 Page - TT Electronics. |
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2 / 2 page ![]() Low Value Flat Chip Resistor LR Series 09.18 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors BI Technologies IRC Welwyn Low Value Flat Chip Resistor LR Series © Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com 04.10 Recommended Solder Pad Dimensions (mm) A B C LR1206 2.0 4.0 1.25 LR2010 3.05 6.5 1.5 LR2512 3.7 7.75 1.5 Note: 1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue. 2. Full AEC-Q200 qualification applies only to European Part Numbers at ohmic values ≥R01. A C B LRC 2512 1 w att LRC 2512 2 w att LRC 2010 0.5 watt LRC 2010 1 w att LR C 1206 0.25 w att LR C 1206 0.5 w att 25 70 150 (°C) 0 20 40 60 80 100 (%) Ambient temperature Ordering Procedure Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces L R F 2 5 1 2 – R 0 1 G W Type Mounting Conventional (element up) Values > R025 F Flip-chip (element down) Size Value (use IEC62 code) Tolerance (use IEC62 code) F 1% G 2% J 5% Packing W Tape 1206 or 2010 3000/reel Standard 2512 1800/reel T1 All sizes 1000/reel Values < R025 AEC-Q200 Table 7 Method Max. (add R05) Typ. (@1R0) ref Test 3 High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2 4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1 6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2 7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2 8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1 0.5 14 Vibration MIL-STD-202 Method 204 R% 0.5 0.05 15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05 16 Thermal Shock MIL-STD-202 Method 107 R% 0.25 0.1 18 Solderability J-STD-002 >95% coverage 21 Board Flex AEC-Q200-005 R% 0.5 0.2 22 Terminal Strength AEC-Q200-006 R% 0.25 0.1 Short Term Overload 6.25 x Pr for 2s R% 0.5 Low Temperature Storage -65°C for 100 hours R% 0.5 Leach Resistance Solder dip at 250°C 90s minimum Ordering Procedure This product has two valid part numbers: European (Welwyn) Part Number: LRF1206-R02FW (1206, 20 milliohms ±1%, Pb-free) L R F 1 2 0 6 - R 0 2 F W 1 2 3 4 5 USA (IRC) Part Number: LRC-LRF1206LF-01-R020-F (1206, 20 milliohms ±1%, Pb-free) L R C - L R F 1 2 0 6 L F - 0 1 - R 0 2 0 - F 1 2 3 4 5 6 7 Electrical Data LR1206 LR2010 LR2512 Power ra ng @70°C wa s 0.5 1 2 Resistance range1 ohms R003 to 1R0 1 2 3 4 5 Type Size Value Tolerance Termination & Packing LR = Conventional orientation (values >R025) 1206 E24 = 3/4 characters R = ohms F = ±1% W Pb-free, standard packing 2010 G = ±2% T1 Pb-free, 1000/reel (non-standard) LRF = Flip-chip orientation (values ≤R025) 2512 J = ±5% PB SnPb finish, standard packing Standard packing is tape & reel 1206 & 2010 3000/reel 2512 1800/reel 1 2 3 4 5 6 7 Family Model Size Termination TCR Value Tolerance Packing LRC LR = Conventional orientation (values >R025) 1206 Omit for SnPb 01 = standard (±100ppm/°C values ≥R05) 4 characters R = ohms F = ±1% Standard packing is tape & reel 2010 LF = Pb-free G = ±2% LRF = Flip-chip orientation (values ≤R025) 2512 J = ±5% Pb-free Pb-free All sizes Pb-free 1000/reel Pb-free Make Possible 12.15 General Note All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronicsresistors.com 3000/reel 1800/reel 1206 & 2010 Pb-free 2512 Pb-free SnPb Pb-free |
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