SGM811-RXKA4 datasheet(4/9 Pages) SGMICRO

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SGM811/812

ELECTRICAL CHARACTERISTICS (continued)

(VCC Typ = 5 V for L/M/J Models, 3.3 V for T/S Models, 3 V for R Models, 2.5 V for Z Models; unless otherwise noted.)

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

RESET/

RESET OUTPUT VOLTAGE

Low (SGM811R/S/T/Z)

VCC = VTH(MIN), ISINK = 1.2mA

0.3

Low (SGM811L/M/J)

VCC = VTH(MIN), ISINK = 3.2mA

0.4

Low (SGM811R/S/T/Z/L/M/J)

VCC > 1.0 V, ISINK = 50µA

0.3

High (SGM811R/S/T/Z)

VCC > VTH(MAX), ISOURCE = 500µA

0.8×VCC

High (SGM811L/M/J)

VCC > VTH(MAX), ISOURCE = 800µA

VCC– 1.5

Low (SGM812R/S/T/Z)

VCC = VTH(MAX), ISINK = 1.2mA

0.3

Low (SGM812L/M/J)

VCC = VTH(MAX), ISINK = 3.2mA

0.4

High (SGM812 R/S/T/Z/L/M/J)

1.8 V < VCC < VTH(MIN), ISOURCE = 150µA

0.8×VCC

Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS

(Typical values are at TA = 25°C, unless otherwise noted.)

Terminal Voltage (With Respect to Ground)

VCC................................................................................–0.3 V to +6 V

All Other Inputs ............................................ –0.3 V to VCC + 0.3 V

Input Current

VCC , MR ................................................................................ 20 mA

Output Current

RESET,

RESET ..................................................................... 20 mA

Power Dissipation, PD @ TA = 25℃

SOT23-5 .....................................................................................0.4W

SOT143-4.................................................................................. 0.32W

Operating Temperature Range...........................- 40°C to +125°C

Junction Temperature...........................................................+150°C

Storage Temperature.............................................- 65°C to +150°C

Lead Temperature (soldering, 10s).....................................+260°C

ESD Susceptibility

HBM..........................................................................................4000V

MM..............................................................................................400V

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational

sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

PIN DESCRIPTION

Pin Number

SGM811

SGM812

NAME

SOT143-4 SOT23-5 SOT143-4

FUNCTION

GND

Ground

No connect.

RESET

—

Active Low Logic Output.

RESET remains low while VCC is below the reset

threshold or when MR is low;

RESET then remains low for at least 160 ms after

VCC rises above the reset threshold.

RESET

—

Active High Logic Output. RESET remains high while VCC is below the reset

threshold or when MR is low; RESET then remains high for 240 ms (typical) after

VCC rises above the reset threshold.

Manual Reset. This active low debounced input will ignore input pulses of 100 ns or

less (typical) and is guaranteed to accept input pulses of greater than 10 µs. Leave

floating when not used.

VCC

Power supply voltage that is monitored.

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