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FDMS8018 数据表(PDF) 2 Page - ON Semiconductor |
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FDMS8018 数据表(HTML) 2 Page - ON Semiconductor |
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2 / 8 page ![]() December 2015 ©2011 Fairchild Semiconductor Corporation FDMS8018 Rev.1.2 www.fairchildsemi.com 1 FDMS8018 N-Channel PowerTrench® MOSFET 30 V, 175 A, 1.8 m Ω Features Max rDS(on) = 1.8 mΩ at VGS = 10 V, ID = 30 A Max rDS(on) = 2.4 mΩ at VGS = 4.5 V, ID = 26 A Advanced Package and Silicon Combination for Low rDS(on) and High Efficiency Next Generation Enhanced Body Diode Technology, Engi- neered for Soft Recovery MSL1 Robust Package Design 100% UIL Tested RoHS Compliant General Description This N-Channel MOSFET has been designed specifically to improve the overall efficiency and to minimize switch node ringing of DC/DC converters using either synchronous or conventional switching PWM controllers.It has been optimized for low gate charge, low rDS(on), fast switching speed ang body diode reverse recovery performance. Applications VRM Vcore Switching for Desktop and Server OringFET / Load Switching DC-DC Conversion Motor Bridge Switch Power 56 D D D D G S S S Pin 1 Bottom Top Pin 1 D D D D S S S G MOSFET Maximum Ratings T A = 25 °C unless otherwise noted Thermal Characteristics Package Marking and Ordering Information Symbol Parameter Ratings Units VDS Drain to Source Voltage 30 V VGS Gate to Source Voltage (Note 4) ±20 V ID Drain Current -Continuous TC = 25 °C (Note 6) 175 A -Continuous TC = 100 °C (Note 6) 110 -Continuous TA = 25 °C (Note 1a) 30 -Pulsed (Note 5) 680 EAS Single Pulse Avalanche Energy (Note 3) 126 mJ PD Power Dissipation TC = 25 °C 83 W Power Dissipation TA = 25 °C (Note 1a) 2.5 TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 °C RθJC Thermal Resistance, Junction to Case 1.5 °C/W RθJA Thermal Resistance, Junction to Ambient (Note 1a) 50 Device Marking Device Package Reel Size Tape Width Quantity FDMS8018 FDMS8018 Power 56 13 ’’ 12 mm 3000 units |
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