5 Pin Configuration and Functions

1

A2

12

FDA_IN+

2

IN+

11

OUT–

3

IN–

10

OUT+

4

A0

9

FDA_IN–

Not to scale

Thermal Pad

Figure 5-1. RGT Package, 16-Pin VQFN (Top View)

Table 5-1. Pin Functions

PIN

TYPE

DESCRIPTION

NAME

NO.

A0

4

Input

Gain setting pin 0

A1

5

Input

Gain setting pin 1

A2

1

Input

Gain setting pin 2

DGND

16

Power

Ground reference for digital logic and gain setting pins

FDA_IN–

9

Input

Connection to output driver summing node

FDA_IN+

12

Input

Connection to output driver summing node

IN–

3

Input

Negative (inverting) input

IN+

2

Input

Positive (noninverting) input

LVDD

7

Power

Output driver positive supply. Connect this pin to the positive supply of the ADC to protect from

overdriving.

LVSS

14

Power

Output driver negative supply. Connect this pin to the negative supply of the ADC to protect from

overdriving.

NC

8

—

Do not connect

OUT–

11

Output

Output (inverting)

OUT+

10

Output

Output (noninverting)

VOCM

13

Input

output common mode control pin

VS+

6

Power

Input stage positive supply

VS–

15

Power

Input stage negative supply

Thermal

Pad

Thermal pad

—

Solder the thermal pad to the printed-circuit board (PCB). Connect the thermal pad to a plane

or large copper pour that is either floating or electrically connected to VS–. Make this connection

even for applications that have low power dissipation.

PGA854

SBOSAN2A – AUGUST 2025 – REVISED DECEMBER 2025

www.ti.com

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