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XP-G2 数据表(PDF) 22 Page - Cree LED |
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XP-G2 数据表(HTML) 22 Page - Cree LED |
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22 / 39 page ![]() Copyright © 2012-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 22 XLAMP® XP-G2 LED THERMAL DESIGN - HIGH EFFICACY The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. THERMAL DESIGN - STANDARD Thermal Design - high efficacy 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 0 20 40 60 80 100 120 140 160 Ambient Temperature (ºC) Rj-a = 10°C/W Rj-a = 15°C/W Rj-a = 20°C/W Rj-a = 25°C/W Thermal Design - standard efficacy Cool White 0 200 400 600 800 1000 1200 1400 1600 0 20 40 60 80 100 120 140 160 Ambient Temperature (ºC) Rj-a = 10°C/W Rj-a = 15°C/W Rj-a = 20°C/W Rj-a = 25°C/W |
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