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OP400GSZ 数据表(PDF) 5 Page - Analog Devices |
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OP400GSZ 数据表(HTML) 5 Page - Analog Devices |
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5 / 16 page ![]() OP400 Rev. E | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating Supply Voltage ±20 V Differential Input Voltage ±30 V Input Voltage Supply voltage Output Short-Circuit Duration Continuous Storage Temperature Range P, Y Packages −65°C to +150°C Lead Temperature (Soldering 60 sec) 300°C Junction Temperature (TJ) Range −65°C to +150°C Operating Temperature Range OP400A −55°C to +125°C OP400E, OP400F −25°C to +85°C OP400G 0°C to 70°C OP400H −40°C to +85°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply to both dice and packaged parts, unless otherwise noted. THERMAL RESISTANCE θJA is specified for worst-case mounting conditions, that is, θJA is specified for device in socket for CERDIP and PDIP packages; θJA is specified for device soldered to printed circuit board for SOIC package. Table 5. Thermal Resistance Package Type θJA θJC Unit 14-Pin Ceramic DIP (Y) 94 10 °C/W 14-Pin Plastic DIP (P) 76 33 °C/W 16-Pin SOIC (S) 88 23 °C/W ESD CAUTION |
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